We know Tesla is already working on the Hardware 4.0 self-driving chip and an exclusive report suggests it’ll be using products from Taiwan Semiconductor Manufacturing Company (TSMC) for the same. Tesla will be using TSMC’s 7nm process and SoW (System on Wafer) technology.
According to sources, Tesla is working with Broadcom to develop ultra-high-performance computing (HPC) chips for its electric vehicles. For the same HPC chips, Tesla will incorporate TSMC’s 7nm process and SoW packaging technology.
Production and testing of these new chips will begin in the fourth quarter of 2021. It will start with an initial production of 2000 wafers. Hopefully, after testing, we can expect these next-generation self-driving chips in Tesla’s electric cars in early 2022.
Next-Gen Tesla Self-Driving Chip Will Be 3 Times Better Than The Current One
Current Tesla vehicles are equipped with Hardware 3.0 autonomous driving chips. Tesla introduced the HW 3.0 in 2019, and at the time, its CEO Elon Musk said the company was already working on the HW 4.0 chip and it’s going to be three times better than the HW 3.0.
Elon also said that it would take them around two years before it comes into the production pipeline. Samsung built the HW 3.0 on a 14nm process technology. However, this time the company will no longer contribute to the development of HW 4.0 for Tesla.
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Furthermore, the new chips will consume lower energy mainly due to the 7nm process allowing for more battery saving, which will directly improve the electric range.
Even now, several EV enthusiasts praise Tesla for its autonomous driving technology. It’ll be exciting to see what wonders Hardware 4.0 will bring in Tesla’s electric cars.
Do share your views in the comments section below on Tesla’s next-generation self-driving chips.